1. 2. 3. material content data sheet sales product name bc 847s h6327 issued 29. august 2013 ma# MA001094634 package pg-sot363-6-1 weight* 6.27 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.006 0.09 935 non noble metal arsenic 7440-38-2 0.000 0.00 9 inorganic material silicon 7440-21-3 0.050 0.80 0.89 7988 8932 leadframe inorganic material silicon 7440-21-3 0.001 0.01 92 non noble metal titanium 7440-32-6 0.003 0.05 459 non noble metal chromium 7440-47-3 0.009 0.14 1378 non noble metal copper 7440-50-8 2.869 45.74 45.94 457409 459338 wire non noble metal copper 7440-50-8 0.010 0.16 0.16 1635 1635 encapsulation organic material carbon black 1333-86-4 0.031 0.49 4871 plastics epoxy resin - 0.657 10.47 104735 inorganic material silicondioxide 60676-86-0 2.368 37.75 48.71 377533 487139 leadfinish non noble metal tin 7440-31-5 0.213 3.40 3.40 33994 33994 plating noble metal silver 7440-22-4 0.056 0.90 0.90 8962 8962 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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